MC33151D |
RFQ for MC33151D Required Field |
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| Technical/Catalog Information | MC33151DR2G |
| Vendor | ON Semiconductor (VA) |
| Category | Integrated Circuits (ICs) |
| Configuration | Low-Side |
| Voltage - Supply | 6.5 V ~ 18 V |
| Current - Peak | 1.5A |
| Delay Time | 35ns |
| Package / Case | 8-SOIC (3.9mm Width) |
| Packaging | Cut Tape (CT) |
| Number of Outputs | 2 |
| Input Type | Inverting |
| Number of Configurations | 2 |
| Operating Temperature | -40°C ~ 125°C |
| High Side Voltage - Max (Bootstrap) | - |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MC33151DR2G MC33151DR2G MC33151DR2GOSCT ND MC33151DR2GOSCTND MC33151DR2GOSCT |
| Product | Manufacturers | Pack | D/C |
| MC33151D | - | N/A | N/A |
| Rating | Symbol | Value | Unit |
| Power Supply Voltage | VCC | 20 | V |
| Logic Inputs (Note 1) | Vin | 0.3 to +VCC | V |
| Drive Outputs (Note 2) Totem Pole Sink or Source Current Diode Clamp Current (Drive Output to VCC) |
IO IO(clamp) |
1.5 1.0 |
A |
| Power Dissipation and Thermal Characteristics D Suffix, Plastic Package Case 751 Maximum Power Dissipation @ TA = 50°C Thermal Resistance, JunctiontoAir P Suffix, Plastic Package, Case 626 Maximum Power Dissipation @ TA = 50°C Thermal Resistance, JunctiontoAir |
|
0.56 180 1.0 100 |
W °C/W W °C/W |
| Operating Junction Temperature | TJ | +150 | °C |
| Operating Ambient Temperature MC34151 MC33151 |
TA | 0 to +70 40 to +85 |
°C |
| Storage Temperature Range | Tstg | 65 to +150 | °C |
